C1T Series

Thick Film chip technology on ceramic substrates, in 0603 and 1206 case sizes. Low cost solutions with UL, CSA and CE approvals. Provide board level primary and secondary circuit protection in a wide variety of applications, including battery chargers, power supplies, modems, routers, consumer electronics, PoE, PoE+, Backplane Short Circuit Protection, etc.

Specifications

  • IR Reflow Process - 260°C, 10 Sec., Max.
  • Multiple Safety Agency Approvals
  • Operating Temperature: -55°C to +125°C
  • Mil-Std 202G Environmental Compliant

Features

  • Ceramic substrate, printed element construction
  • RoHS6 Compliant
  • Pb-Free
  • Halogen-Free
  • T&R, Auto-Insertable

Email Form

Thick Film chip technology on ceramic substrates, in 0603 and 1206 case sizes. Low cost solutions with UL, CSA and CE approvals. Provide board level primary and secondary circuit protection in a wide variety of applications, including battery chargers, power supplies, modems, routers, consumer electronics, PoE, PoE+, Backplane Short Circuit Protection, etc.

Specifications

  • IR Reflow Process - 260°C, 10 Sec., Max.
  • Multiple Safety Agency Approvals
  • Operating Temperature: -55°C to +125°C
  • Mil-Std 202G Environmental Compliant

Features

  • Ceramic substrate, printed element construction
  • RoHS6 Compliant
  • Pb-Free
  • Halogen-Free
  • T&R, Auto-Insertable

Email Form

Tech Help  
Please fill in below and send.

{{result}}

Tech Help