CIN::APSE®
CIN::APSE®

CIN::APSE®

CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications. CIN::APSE is the most widely implemented crimpless and solderless, high speed, interconnect in the industry. The simple 2-piece, patent protected design enables 50+ Gbps, and wide range of profiles from 0.020” to 1.0”. CIN::APSE contacts are available in 1.0 mm and 2.0 mm diameters with a standard pitch of 1.0 mm or greater. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. The CIN::APSE interconnects have proven reliability under the most extreme mechanical shock and vibration.

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CIN::APSE solderless, high density, custom interconnects are used for board to board, IC to board, flex to board and component to board applications. CIN::APSE is the most widely implemented crimpless and solderless, high speed, interconnect in the industry. The simple 2-piece, patent protected design enables 50+ Gbps, and wide range of profiles from 0.020” to 1.0”. CIN::APSE contacts are available in 1.0 mm and 2.0 mm diameters with a standard pitch of 1.0 mm or greater. The number of contacts is not limited and the largest connector implemented to date contained 7,396 I/Os. Solderless termination is achieved through compression and the unique contact design assures multiple points of contact per I/O. The CIN::APSE interconnects have proven reliability under the most extreme mechanical shock and vibration.

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Product Overview

CIN::APSE

CIN::APSE connectors are simple

They are constructed of 2 main components, and insulating housing and an electrically conducting contact. The liquid crystal polymer insulators are molded and the contacts are a bundled gold-plated molybdenum wire. Gold plated copper spacers are used for long Z-axis connectors.



CIN::APSE

CIN::APSE positioning

CIN::APSE positioning is designed into the insulating housing. Insulation housing are molded for high volume and machined for prototypes.




CIN::APSE

CIN::APSE mounting

CIN::APSE connectors are positioned and mounted between boards and components using generally available alignment and compression hardware. Hardware can be press fit into PBC or utilized with a bolster plate for maintaining even compression across a large socket. Designers recommend PCB layout for gold plated pads and alignment holes locations.





Features

CIN::APSE have high density and is easily installed in two basic steps, without soldering. They are also highly customizable and very reliable. See detail features description below.


J-Lite


 • Maximize SWaP (Size, Weight and Performance) for space and weight constrained designs

 • Pitch grid of 2.00 mm, 1.00 mm and 0.80 mm achievable

 • Thin profiles from 0.020” and greater

 • 2-piece design reduces additional space and weight

Solderless



 • Compression sufficient for establishes multiple points of contact, RoHS compatible

 • No thermal processing or X-ray inspection required

 • Reversible mating process for multiple cycles

Customizable

 • Design team available for mechanical drawings and product sketches

 • Prototypes available for low quantities

 • Profile thicknesses from 0.020” to 1.0”

 • 2 to 7,356 contacts have been used per connector, but no limit exists

 • IC-to-PCB, PCB-to-PCB, Flex-to-PCB, Component-to-PCB

Reliable

 • Excellent shock and vibration stability, 100 Gs shock, 20 Gs vibration

            o Customer specific application passed @ 22,000 Gs

 • Thermally stable, life and cycle testing, 5,000 hrs @ 170°C

            o Customer specific application passed @ -200°C

 • Electrically stable, > 1,000 MΩ @ 500 VDC


Applications

CIN::APSE is used in various applications such as Aerospace, Datacenters or Test Equipment. Below you can find some successful projects in which CIN::APSE products were used.


Aerospace Applications

United Technology: ASIC LGA Socket in P&W Engine FADEC Engine Controller

Instrumentation

Lecroy: 100GHz Oscilloscope

Radar

Northrop Grumman: Board Interposer in AESA Radar RF Module

Satellite

MDA: Flex to PBC Connector for Radarsat Constellation RF Module

Servers

Sun-Oracle: LGA Sockets for Datacom Servers

Network Switches

Infinera: LGA Sockets for Optical Network Switches